Batteries & Chargers

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Workshop Philips Cree Led High Bay Lamp 200 Watt With 400W HPS

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Quick Detail:
# # Input Voltage (V): AC200~480V 50/60Hz
# Place of Origin: Guangdong China
# Lamp: CREE XLMB
# Heat Pipe
# Fins Cooling Design For 1070 Aluminum Alloy
# Based On Crees sc3 Technology Planform
# Using Dlc Technology For Mpc


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Product description:
# CREE Second Generation XMLB LED, high luminous efficiency and long life.
# MEAN WELL High efficiency LED Driver, the wide range input voltage AC200-480V；
# Heat pipe with fins cooling design, better cooling, light quality, LED Tj < 85℃.
# Excellent lampshade design, greatly improve the light utilization and evenness.

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Applications:

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UL LED High Bay Lighting series can be widely used in outdoor, indoor or outdoor lighting(Wet location), like mechanical or electronic processing workshops, storage warehouses, steel mills, gas stations, toll booth, waiting rooms, the platforms of railway station , indoor stadiums and flower cultivating tents etc.

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Specifications:

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Type | ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ?UL-HB30W48-xxK |
Power | 300W | Lighting Angle | 45°/80°/120° |
Input Voltage | AC200-480V | LED Brightness Decay | <5%/6000 hrs |
PF | >0.95 | Working Life | >50000 hrs |
Driver Efficiency | >90% | Working Temperature | -30 - +40℃ |
Luminous Flux | 28500 Lm | Storage Temperature | -40 -+80℃ |
Color Temperature | 3000K/4000k/5000K/6500k | Protection Level | Wet Location/IP65 |
CRI | Ra>75 | Cable | 3 core,18AWG(1.5m)
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Structure Features
# Shell materials: Heat pipe and cooling fins for 1070 aluminum alloy.
# Color: Silver white (Electrolytic shading)
# Net weight: 11.50Kg
# Unit: mm

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Competitive Advantages:

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1, BASED ON CREES SC3 TECHNOLOGY PLANFORM

Using XMLB LED of CREE Inc,Based on Cree’s SC3 technology platform,High efficiency and high reliability.

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2, TESTING BY X-RAY

LED soft soldering testing by X-RAY for cold solder joint and soldering related non-conforming.

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3,COPPER SUBSTRATE

Heat conductivity coefficient of copper substrate is 383.8W/m.K,but the traditional aluminum substrate is about 2.0-3.0W/m.K.

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4,USING DLC TECHNOLOGY FOR MPCB

Using DLC technology for MPCB module,heat conduction rate at 200W/m.K,lower junction temperature.

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5,USING METAL POWDER ADHESIVE

Using high conduction adhesives 30W/m.K,not the heat conductive silicone grease,it’s metal powder adhesive.

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6,USING HEAT PIPE AND COOLING FINS FOR 1070 ALUMINUM ALLOY

Using heat pipe and cooling fins for 1070 aluminum alloy,fast conduction.

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7,24 HOURS HIGH TEMPERATURE TESTING

High temperature testing room at 106℉,24 hours aging after aging.

30 minutes switch aging(10 seconds per cycle)