Electronic & Electrical

Product DetailsType7 high Ag no clean solder paste SAC305BBIEN’S LF-01 SAC305(SN96.5Ag3.0Cu0.5) is a lead-free,Website:http://www.bbiensolder.com, no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. This product is also designed to enable consistent fine pitch printing capability, down to 180μm circle printed with 100μm thickness stencil.Availability:Available type:it is available in Sn96.5Ag3.0Cu0.5 type 3 powder mesh is normally recommended, but type4,type5,type6 and type7 are all skilled and available for this alloy solder paste.Available packing:500g,50g per jar; 100g per syringe/tubeBBIEN’S LF-01 SAC305(SN96.5Ag3.0Cu0.5) solder paste is available for fine pitch applications with SnAgCu alloys in a similar melting range to the listed alloys,for specific packaging information.BBIEN SAC305 silver solder paste is a synthetic poly-adduct designed to exceed requirements for reliable solder joints in SMT PC board assemblies. This paste was formulated to replace traditional rosin/resin based no-clean formulations with more reliable synthetic materials. The residue is pin probable for ICT inspection. Sn96.5Ag3.0Cu0.5 no clean solder paste does not require refrigeration if left at room temperature 23degree for 3 months and has a 8-12-month refrigerated (2-9degree) shelf life.Storage, Handling, and Shelf Life:Refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity,reflow characteristics, and overall performance. BBIEN’S SAC305 should be stabilized at room temperature prior to printing. BBIEN SAC305 should be kept at standard refrigeration temperatures, 0-10°C (32-50°F). Please contact BBIEN,if you require additional advice with regard to storage and handling of this material. Shelf life is 6months from date of manufacture and held at 3~10°C (32-50°F).Packing Details:Packing could be classified as can/bottle packing