Thermal Phase Changing Low Melting Materials , Heat Sensitive Materials For Notebook - TIC?808G series
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Thermal Phase Changing Low Melting Materials , Heat Sensitive Materials For Notebook
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TIC?800G series is? low melting point thermal interface material. At 50℃, TIC?800G series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.TIC?800G series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
TIC?800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
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Applications Include:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
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Features:
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For Lowest Thermal Resistance :
> 0.014℃-in2 /W thermal resistance
> Naturally tacky at room temperature,
? ? ?no adhesive required??????????? ?
> No heat sink preheating required
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Typical Properties of TICTM800G Series |
Product Name | TICTM805G | TICTM808G | TICTM810G | TICTM812G | Test Method |
Color | Gray | Gray | Gray | Gray | Visual |
Thickness | 0.005& quot;
(0.126mm) | 0.008& quot;
(0.203mm) | 0.010& quot;
(0.254mm) | 0.012& quot;
(0.305mm) | |
Thickness Tolerance? | ±0.0008& acute;& acute;
(±0.019mm) | ±0.0008& acute;& acute;
(±0.019mm) | ±0.0012& acute;& acute;
(±0.030mm) | ±0.0012& acute;& acute;
(±0.030mm) | |
Density | 2.6g/cc | Helium Pycnometer |
Temperature range | -25℃～125℃ | |
Phase Change Softening Temperature | 50℃~60℃ | |
& quot;Burn In& quot; Temperature | 70℃ for 5 minutes | |
Thermal Conductivity | 5.0 W/mK | ASTM D5470 (modified) |
Thermal Impedance @ 50 psi(345 KPa) | 0.014℃-in2/W | 0.020℃-in2/W | 0.038℃-in2/W | 0.058℃-in2/W | ASTM D5470 (modified) |
0.09℃-cm2/W | 0.13℃-cm2/W | 0.25℃-cm2/W | 0.37℃-cm2/W |
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Standard Thicknesses:
0.005& quot;(0.127mm)????????? 0.008& quot;(0.203mm)????????? 0.010& quot;(0.254mm)??????? 0.0012& quot;(0.305mm)?????????????????????? ?
Consult the factory alternate thickness.
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Standard Sizes:
?10& quot; x 16& quot;(254mm x 406mm)?????? 16& quot; X 400& acute;?? (406mm X 121.92M)???????????? ?
TIC?800 series are supplied with a white release paper and a bottom liner. TIC800? series is available in kiss cut an extended pull tab liner or individual die cut shapes.
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Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC?800 series products.
Reinforcement:
No reinforcement is necessary.
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Dongguan Ziitek Electronic Materials & Technology company
Address: Building B8, Industry District 鈪? Xicheng, Hengli Township, Dongguan City, Dongguan, guangdong, China, 523000
Tel: 86-0769-38801208
聽 聽 聽Ziitek Thermal Conductive Materials & Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.聽聽
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