Electronic & Electrical

Product DetailsSn-Bi-Ag 179degree lead free soft solid BBIEN LF-05 solder wireSn64Bi35Ag1Introduction for Sn64Bi35Ag1 Solder WireBBIEN LF-05 Tin-Bismuth-silver(Sn64Bi35Ag1)solder wire,with a melting point of 179 degrees Celsius,is ideal for soldering of temperature sensitive components.Supplied as a solid core(no inner flux core)lead free solder wire,this solder gives good wetting and solder flow.Packaged as a 200g,250g,500g and 1000g both spool packing and box packing,this solder wire we recommend using with the flux gel to promote increased rapid wetting.Brief Introduction for BBIENBBIEN is specialized in soldering industry from 2000,known as a experienced solder wire,Pb free and lead solder wire manufacturer,whose products are made in China,since then,BBIEN pays high attention to Research and Development,continuous technical innovation for bismuth solder wire,Sn-Bi,Sn-Bi-Ag,Sn-Cu,Sn-Ag-Cu industry,until now,we accumulate much valuable experience,six senior solder paste engineers operate a specialized reflowing solder paste production.Purity and chemistry componentSpecificationSn64Bi35Ag1-no flux core solder wireAppearanceLucent,no dirt on surfaceWeightNet:500g/case;1000g/caseChemistry componentElements Specification(%)Tested result(%WT)Sn 63.0~65.0 64.0Ag 0.8~1.2 1.0Al 0.005 0.0003As 0.030 0.0060Sb 0.050 0.0148Bi Remainder RemainderCu 0.080 0.0003Fe 0.010 0.0003In 0.050 0.0019Ni 0.010 0.0007Pb 0.050 0.0257Cd 0.002 0.0002Au 0.050 0.0010An 0.050 0.0002a.The above concentration of specification are in%weight.b.Single value listed are the maximum allowable standard.Flux content(%):0Diameter of wire:0.5mm,0.6mm,0.8mm,1.0mm,1.5mm and 2.0mmPhysical feature of Sn64Bi35Ag1 solid solder wireAlloy componentMeltingpoint℃Working temperature℃Gravity g/cm3Rigidity HBConduct heatM.S.KExtendMpaExtendrate%Conductivity%Sn64Bi35Ag1179100~2108.5~8.711~12684570-10018.0The more informations about Sn64Bi35Ag1 middle temperature metiong lead free solder wire,please feel freely contact wi