Electronic & Electrical

Product DetailsBBIEN LF-03 SAC305 lead free wave silver soldering barProduct’s Introduction forSAC305BBIEN LF-03 SAC305(Sn96.5Ag3.0Cu0.5)is a lead-free solder according to ISO9001:2008 which can replace eutectic or almost eutectic tin/lead or tin/lead/silveralloys.BBIEN LF-01 SAC305 alloy solder bar is manufactured from pure metals and hasbeen developed to eliminate the use of tin/lead alloys in all existing production processesin electronics manufacturing and guarantees a lead-free wave soldering process.Products Characteristics AdvantageGood wetting characteristicsMelting range of 217 to 222°CLonger service life due to reduced copper contentLower cost than eutectic SnAgCu alloy due to 0.8%lower silver contentYield–Best in class yield,out performs all Sn/Cu based materialsWetting speed–fast wetting,in back to back tests 0.65s compared to 1.00s,for Sn/Cu based materialsDross generation–Low dross generation delivered by Vaculoy alloy conditioningExcellent solderability due to fast wetting speedVery good drainage,has lower levels of bridging compared to Sn/Cu alloysDelivers excellent performance across a wide range of Flux technologies.The proprietary Vaculoy process is a highly effective method for removing includedoxides from solder.This is extremely important because included oxides generateexcessive drossing and increase the viscosity of the solder.Solder with higher viscositycan result in increased soldering defectsApplication Notes:On changing to lead-free production the temperature profile and process conditions for this alloy-like for any other lead free alloys,too-must be adjusted.The resulting solder joints will have comparable or even better characteristics than solder joints,which were made with Sn/Pb solders.During the use in a solder bath the copper content increases with the consequence,that the liquidus of the alloy is rising,causing soldering defects Therefore a regular analytical control of the solder composition is necessary in order to maintain the