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Refrigerant R116 Electronic Gases Hexafluoroethane CAS 2551-62-4

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Description:

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Electronic Gases Hexafluoroethane is used as a versatile etchant in semiconductor manufacturing. It can be used for selective etching of metal silicides and oxides versus their metal substrates and also for etching of silicon dioxide over silicon. The primary aluminum and the semiconductor manufacturing industries are the major emitters of hexafluoroethane.

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Hexafluoroethane is relatively inert. The mixture is nonflammable and nontoxic, though asphyxiation may occur because of displacement of oxygen. Under prolonged exposure to fire or intense heat the containers may rupture violently and rocket.

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Hexafluoroethane is chemically inert in many situations, but can react violently with strong reducing agents such as the very active metals and the active metals. Can react with strong oxidizing agents or weaker oxidizing agents under extremes of temperature.

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Vapors may cause dizziness or asphyxiation without warning. Vapors from liquefied gas are initially heavier than air and spread along ground. Contact with gas or liquefied gas may cause burns, severe injury and/or frostbite. Fire may produce irritating, corrosive and/or toxic gases.

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Some may burn but none ignite readily. Containers may explode when heated. Ruptured cylinders may rocket.

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Specifications:

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1. Physical properties

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Commodity | ?Hexafluoroethane |
Molecular Formula | ?R116 |
CAS No | ?76-16-4 ? |
UN No. | ? 2193 ? |
Hazardous Class | ?2.2 |
MF: | ? C2F6 ? |
Cylinder Capacity | ?40L, 500L |
Filling Weight | ? ?530kg/500L refillable cylinder ?20kg/40L refillable cylinder ? |
Storage and Transportation | ? Use, store and transport below 45C. Store in cool and well-ventilated areas. Keep away from fire, heat, sunlight and flammable substances. Handle carefully when loading and unloading to avoid damages to gas cylinders and accessories. ? |
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2. Typical technical data

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Purity, % | ≥99.8 |
Moisture, PPm | ≤10 |
Acidity, PPm | ≤1 |
Vapor Residue, PPm | ≤100 |
Appearance | Colorless, No turbid |
Odor | No Strange Stench |
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Molecular Weight | 66.1 |
Boiling Point, °C | -24.7 |
Critical Temperature, °C | 113.5 |
Critical Pressure, Mpa | 4.58 |
Specific Heat of Liquid, 30°C, [KJ/(kg°C)] | 1.68 |
ODP | 0 |
GWP | 0.014 |
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Applications:

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Multi - Functional Etching Technology | In The Production Of Semiconductor, and?Refrigerant. |
The Metal Substrate | It can be used in the selective etching of metal silicon metal and metal oxide. Under prolonged exposure to fire or intense heat the containers may rupture violently and rocket. |
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