Passive Components

Layer count
1-36 layers
Min line width/space
3mil/3mil
Mim Mechanical drilling hole size
Board thickness≤1.2mm 0.15mm
Board thickness≤2.5mm 0.2mm
Board thickness>1.2mm Aspect ratio≤15:1
Finished board thickness
Max: 10mm
Min: 2 layers-0.2mm; 4 layers-0.35mm; 6 layers-0.55mm;
8layers-0.7mm, 10layers-0.9mm
Finished copper thiciness
Inner layer/outer layer:6oz/10oz
Max panel size
610*1200mm
Impedeance Tolerance
±10%
Min Dielectric thickness
2mil
Type of dielectric meterial
FR4,high TG,Flex,rigid,rigid-terial,High frequency material,PTFE material,heavy copperfoil,paperphenolic plate,BT,PI,Composite material,PTFE+ metal based
Major Material supplier
FR4:Shengyi,ITEQ,Isola,KB,Arlon
PTFE:Rogers,Taconic,Nelco,Wangling,
Metal based meterial:Bergquist,Laird,Totking,ITEQ,Arlon,

Soldermask colour
green,red,blue,white,black,yellow
Surface treatment
HASL ,immsersion gold,immersion silver,OSP,gold finger

Special process
Multilayer PCB with blind or buried vias, impedance control
Quality control
AOI,100% electronic test

Mount range
0201,0402,0603.0805,1206,1210.chips,QFN,QFP,BGA,LGA,DSP,CSP assembly;through hole parts assembly
Mount Accuracy
±0.05MM
Max PCB size
Sample:400*800mm;Volume 350*550mm
Max components height
25.4mm
Min pitch for QPF/SOP/SOJ/IC
0.3mm
Min pitch for GSP/BGA
0.3mm
Test
AOI,eyes testing,function test,temperature cycling