Electronic & Electrical

PCB AssemblySummaryOne-stationmanufacturing? ? ?? ? ?? ? ?? ? ?? ? ?solutions·One-stop service in manufacturing.·Abundant product lines to meet any needs.·Real-time tracking of manufacturing progress.·Professional DFM technical support.·Focus on the production line to cost control.Development to MP, Single panel to HDI boards, Industrial equipment to consumer electronics,According to a variety of different needs, we can provide you with the best solutions and service.Fabrication?CapabilityLayer count2 to 40L?Drilling Hole to hole accuracy±0.075mm ±0.003i?PTH Tolerance±0.05mmMaximum Panel size533×610mm21i×24iNPTH Tolerance±0.076/-0mm ±0.003i/-0iMinimum Board thickness0.60mm 0.024iRouting Edge to Edge accuracy±0.10mm ±0.004iMin.drill size0.20mm 0.0078iMaximum Board thickess2.4mm 0.0945iAspect Ratio6:1Stamping Edge to Edge accuracy±0.076mm ±0.003iMinimum core thickness(I/L)0.75mm 0.003iTrace width tolerance(≥4mils)±20%Minimum Cu thickness(Base)1/3 oz 12umMinimum trace width0.076mm 0.003iVee-cut Edge to Edge accuracy±0.127mm ±0.005iMaximum Cu thickness(Base)2.0 oz 70umRegistration(O/L)±0.076mm ±0.003i√?1pcs OK ? √?Meddle-small lot ? √?BVH/IVH ? √?Special material ? √?Rigid and flexible ? √?Halogen-free ? √?ExpeditedProductsAssembly?CapabilityMin. chip: 0201 (0603), 0402 (1005)Min. spacing: BGA 0.4mm Pitch, QFP/QFP 0.3mm PitchMax. size: 533×610mmSupport type: Manual welding, DIP plug-in, SMT, Cable making, BGA ball, Rework, Connector crimpingSupport product: Communications, Industrial control, Chip testing, Automotive electronics, Medical equipment,etc.Support mode: Processing, Feed processing, Bonded processing, Processing of non-bonded√?Japan imported equipment √?Two decades of experience √?Focus on prototyping √?Real-time progress trackingProduction lineSMT DIP assembly soldering.pdf