Electronic & Electrical

Product DetailsMid temperature no clean solder paste LF-04 Sn64.7Bi35Ag0.3Brief IntroductionBBIEN is a specialized solder pastes manufacturer in China,Website:http://www.bbiensolder.com, LF-04 Sn64.7Bi35Ag0.3Solder paste is silver gray appearance, made up with metal powder and some active resin mixture. It’s specific gravity from 7.2 to 8.5. They are available for immediate delivery in jars, cartridges, syringes and can/box packing. They could be applied for your SMT technical requirements. We offer a short turn around time on orders and can ship to meet your just-in-time requirements.?LF-04 Sn64.7Bi35Ag0.3 RoHS standard Pb-free bismuth tin solder paste is designed for middle temperature,its melting point from 138degree to 187degree Celsius.Feature BBIEN LF-04 Sn64.7Bi35Ag0.3 offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications.? Our offering includes leading lead-free, no-clean, halogen-free solder paste technologies for applications such as fine feature printing, low temperature processing, and many others. ?Solder pastes are available in a wide range of alloy Sn-Bi-Ag also offered in solder bar, preforms, wire, and spheres for assured alloy compatibility and stronger solder joints.? BBIEN LF-04?Sn64.7Bi35Ag0.3?solder pastes conform to our customers’ unique processes, as well as the challenging environmental regulations they are required to follow.The use of LF-04 Sn64.7Bi35Ag0.3 solder paste can help reduce costly defects associated with soldering known good memory devices to known good processor packages by bridging gaps that flux alone may not.Excellent printing characteristics to16-20 mils pitch■ Excellent print and reflow characteristics for 0201 applications■ Processable by air or nitrogen reflow■ Classified as ROL0 per J-STD-004Physical featureMeltingPoint (°C)Powder Size? (μm)Metal Content (wt%)Viscosity (Pa·s)Tack (gf)Slump TestSolder Ball