LED substrate back side grinding wheel manufacturer - HMT-12
LED substrate back side grinding wheel manufacturer For Sale, Most Competitive Price, Fast Delivery, Custom Service, Wholesale LED substrate back side grinding wheel manufacturer, Made in China, High Quality Products!, China back side diamond grinding wheel manufacturer, LED substrate back side grinding wheel Supplier, Manufacturer.
Homray Material Technology can provide various diamond back side grinding wheels for grinding machine with many brands. They are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by in-house facility, which ensures excellent grinding performance and lower cost for our customers in the world.
Get QuoteHomray Material Technology
Address: LiSheng Industrial Building,60 Suli Road, Suzhou, Jiangsu, China, 215000
Tel: 0086-67084276
Homray as the leading manufacturer and supplier of good quality diamond cutting wire, double side lapping carrier, epoxy resin working carrier, blue steel lapping carrier and ceramic block for wafer bonding, resin copper polishing plate, ductile cast iron lapping plate ,diamond edge grinding wheel, back side grinding wheel and ceramic conditioning ring etc. Our diamond cutting wire, resin lapping carrier and other consumables are widely used in various Multi Wire Saw Machine, Double Side Lapping Machine, DMP Machine (Cu Polishing Machine) for LED sapphire substrate wafer polishing, lapping process and LED EPI wafer thinning process.
