High Frequency Microprocessors Thermal Interface Pad Low Resistance -25℃ - 125℃ - TIC?800P

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High Frequency Microprocessors Thermal Interface Pad Low Resistance -25℃ - 125℃

High Frequency Microprocessors Thermal Interface Pad Low Resistance -25℃ - 125℃

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? The TIC?800P?Series?is?low melting point thermal interface material. At 50℃, The TIC?800P?Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC?800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

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???? The TIC?800P?Series?shows no thermal performance degradation after 1,000?hours@130℃,or?after 500 cycles, from -25℃ to?125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.?


Features:


> ?0.024℃-in2 /W thermal resistance
> ?Naturally tacky at room temperature, no?adhesive required?????????????
> ?No heat sink preheating required?


Applications:
> ?High Frequency Microprocessors
> ?Notebook and Desktop PCs
> ?Computer Serves
> ?Memory Modules
> ?Cache Chips
> ?IGBTs

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Typical Properties of?TIC?800P Series |
Product Name | TICTM803P | TICTM805P | TICTM808P | TICTM810P | Testing standards |
Color | Pink | Pink | Pink | Pink | Visual |
Composite Thickness | 0.003& quot;
(0.076mm) | 0.005& quot;
(0.126mm) | 0.008& quot;
(0.203mm) | 0.010& quot;
(0.254mm) |   |
Thickness Tolerance | ±0.0006& quot;
(±0.016mm) | ±0.0008& quot;
(±0.019mm) | ±0.0008& quot;
(±0.019mm) | ±0.0012& quot;
(±0.030mm) |   |
Density | 2.2g/cc | ??Helium? Pycnometer |
Work temperature | -25℃~125℃ |   |
phase transition? temperature | 50℃~60℃ |   |
Setting temperature | 70℃ for 5 minutes |   |
Thermal conductivity | 0.95?W/mK | ASTM D5470 (modified) |
Thermal lmpedance @ 50 psi(345 KPa) | 0.021℃-in2/W | 0.024℃-in2/W | 0.053℃-in2/W | 0.080℃-in2/W | ASTM D5470 (modified) |
0.14℃-cm2/W | 0.15℃-cm2/W | 0.34℃-cm2/W | 0.52℃-cm2/W |
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? Standard Thicknesses:
0.003& quot;(0.076mm)????????? 0.005& quot;(0.127mm)????????? 0.008& quot;(0.203mm)????????? 0.010& quot;(0.254mm)??????????????????
Consult the factory alternate thickness.
Standard Sizes:
9& quot; x 18& quot;(228mm x 457mm)??????9& quot; x 400& acute;(228mm x 121M)??????????????
TIC?800 series are supplied with a white release paper and a bottom liner. TIC?800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:?
Peressure Sensitive Adhesive is not applicable for TIC?800 series products.
Reinforcement:?
No reinforcement is necessary.

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Dongguan Ziitek Electronic Materials & Technology company

Address: Building B8, Industry District 鈪? Xicheng, Hengli Township, Dongguan City, Dongguan, guangdong, China, 523000
Tel: 86-0769-38801208
聽 聽 聽Ziitek Thermal Conductive Materials & Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.聽聽

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