FR 4 High Tg PCB Red Solder Mask 3 Microinch Gold For System Integration - BIC-1516-VER2.2
FR 4 High Tg PCB Red Solder Mask 3 Microinch Gold For System Integration For Sale, Most Competitive Price, Fast Delivery, Custom Service, Wholesale FR 4 High Tg PCB Red Solder Mask 3 Microinch Gold For System Integration, Made in China, High Quality Products!, China cheap prodocuts, china suppliers Supplier, Manufacturer.FR 4 High Tg PCB Red Solder Mask 3 Microinch Gold For System Integration
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PCB Data Sheets
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PCB SIZE | 160 x 260mm=3PCS |
BOARD TYPE | |
Number of Layers | Multilayer PCB, 4 Layer PCB |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- 35um(1oz)+plate TOP layer |
Prepreg 7628 0.195mm |
copper ------- 18um(0.5oz) MidLayer 1 |
FR-4 1.0mm |
copper ------- 18um(0.5oz) MidLayer 2 |
Prepreg 7628 0.195mm |
copper ------- 35um(1oz)+plate BOT Layer |
TECHNOLOGY | |
Minimum Trace and Space: | 5.9mil/7.4mil |
Minmum / Maximum Holes: | 0.787/5.0mm |
Number of Different Holes: | 12 |
Number of Drill Holes: | 3250 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 0 |
Impedance Control | no |
BOARD MATERIAL | |
Glass Epoxy: | FR-4, ITEQ IT-180 TG>170, er<5.4 |
Final foil external: | 1.5oz |
Final foil internal: | 1oz |
Final height of PCB: | 1.6mm ±0.16 |
PLATING AND COATING | |
Surface Finish | Immersion Gold (33.4%) 3 micoinch over 100 microinch nickle |
Solder Mask Apply To: | Top and Bottom, 12micron Minimum |
Solder Mask Color: | Red |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing, Fiducial Marks |
MARKING | |
Side of Component Legend | TOP |
Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated Through Hole(PTH), via tented |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059& quot; |
Board plating: | 0.0029& quot; |
Drill tolerance: | 0.002& quot; |
TEST | 100% Electrical Test prior shipment |
APPLICATION: | System integration |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
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Advantages
a) Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260℃
b) Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.
c) Meeting your printed circuit board needs from PCB prototyping to mass volume production.
d) No minimum order quantity. 1-10 pieces are offered for sale.
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More Applications in Electronics
Gateway
Rfid
Inverter
Antenna
Wifi Booster
Contract Manufacturing Services
Low Cost Plc
Embedded Systems Development
Embedded Computer Systems
Ac Power Supplies
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IT-180 Data Sheets (Properties)
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ITEQ Laminate/ Prepreg : IT-180ATC / IT-180ABS |
IPC-4101C Spec / 99 / 101 / 126 |
LAMINATE( IT-180ATC) |
Property | Thickness<0.50 mm | Thickness≧0.50 mm | Units | Test Method |
[0.0197 in] | [0.0197 in] |
Typical Value | Spec | Typical Value | Spec | Metric | IPC-TM-650 |
(English) | (or as noted) |
Peel Strength, minimum | | | | | N/mm | 2.4.8 |
A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil] | | | | | (lb/inch) | 2.4.8.2 |
B. Standard profile copper foil | 0.88 (5.0) | 0.70 (4.00) | 0.88 (5.0) | 0.70 (4.00) | | 2.4.8.3 |
1. After Thermal Stress | | | | | | |
2. At 125°C [257 F] | | | | | | |
3. After Process Solutions | 1.23 (7.0) | 0.80 (4.57) | 1.40 (8.0) | 1.05 (6.00) | | |
| 1.05 (6.0) | 0.70 (4.00) | 1.23 (7.0) | 0.70 (4.00) | | |
| 1.05 (6.0) | 0.55 (3.14) | 1.23 (7.0) | 0.80 (4.57) | | |
Volume Resistivity, minimum | | | | | MW-cm | 2.5.17.1 |
A. C-96/35/90 | 3.0x1010 | 106 | -- | -- |
B. After moisture resistance | -- | -- | 3.0x1010 | 104 |
C. At elevated temperature E-24/125 | 5.0x1010 | 103 | 1.0x1010 | 103 |
Surface Resistivity, minimum | | | | | MW | 2.5.17.1 |
A. C-96/35/90 | 3.0x1010 | 104 | -- | -- |
B. After moisture resistance | -- | -- | 3.0x1010 | 104 |
C. At elevated temperature E-24/125 | 4.0x1010 | 103 | 4.0x1010 | 103 |
Moisture Absorption, maximum | -- | -- | 0.12 | 0.8 | % | 2.6.2.1 |
Dielectric Breakdown, minimum | -- | -- | 60 | 40 | kV | 2.5.6 |
Permittivity (Dk, 50% resin content) | | 5.4 | | 5.4 | -- | |
(Laminate & Laminated Prepreg) | | | |
A. 1MHz | 4.4 | 4.4 | 2.5.5.9 |
B. 1GHz | 4.4 | 4.4 | |
C. 2GHz | 4.2 | 4.3 | 2.5.5.13 |
D. 5GHz | 4.1 | 4.1 | |
E. 10GHz | 4 | 4.1 | |
Loss Tangent (Df, 50% resin content) | | 0.035 | | 0.035 | -- | |
(Laminate & Laminated Prepreg) | | | |
A. 1MHz | 0.015 | 0.014 | 2.5.5.9 |
B. 1GHz | 0.015 | 0.015 | |
C. 2GHz | 0.015 | 0.015 | 2.5.5.13 |
D. 5GHz | 0.016 | 0.016 | |
E. 10GHz | 0.017 | 0.016 | |
Flexural Strength, minimum | | | | | N/mm2 | 2.4.4 |
A. Length direction | -- | -- | 500-530 | 415 | (lb/in2) |
| -- | -- | (72,500-76,850) | -60,190 | |
B. Cross direction | -- | -- | 410-440 | 345 | |
| -- | -- | (59,450-63,800) | -50,140 | |
Arc Resistance, minimum | 125 | 60 | 125 | 60 | s | 2.5.1 |
Thermal Stress 10 s at 288°C [550.4F],minimum | | | | | Rating | 2.4.13.1 |
A. Unetched | Pass | Pass Visual | Pass | Pass Visual |
B. Etched | Pass | Pass Visual | Pass | Pass Visual |
Electric Strength, minimum | 45 | 30 | -- | -- | kV/mm | 2.5.6.2 |
(Laminate & Laminated Prepreg) |
Flammability, | V-0 | V-0 | V-0 | V-0 | Rating | UL94 |
(Laminate & Laminated Prepreg) |
Glass Transition Temperature(DSC) | 175 | 170 minimum | 175 | 170 minimum | ?C | 2.4.25 |
Decomposition Temperature | -- | -- | 345 | 340 minimum | ?C | 2.4.24.6 |
(5% wt loss) |
X/Y Axis CTE (40℃ to 125℃) | -- | -- | 10--13 | -- | PPM/?C | 2.4.24 |
Z-Axis CTE | | | | | | 2.4.24 |
A. Alpha 1 | -- | -- | 45 | 60 maximum | PPM/?C |
B. Alpha 2 | -- | -- | 210 | 300 maximum | PPM/?C |
C. 50 to 260 Degrees C | -- | -- | 2.7 | 3.0 maximum | % |
Thermal Resistance | | | | | | 2.4.24.1 |
A. T260 | -- | -- | >60 | 30 minimum | Minutes |
B. T288 | -- | -- | >30 | 15 minimum | Minutes |
CAF Resistance | -- | -- | Pass | AABUS | Pass/Fail | 2.6.25 |
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FAQ
Do you sell high frequency PCB?
Yes. We offer high frequency PCB and hybrid of high frequency and FR-4 mixed. The most used high frequency material is RO4350B and RO4003C, double sided and multilayer.
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BICHENG ENTERPRISE LIMITED
Address: 3 203 Shidai Jingyuan Fuyong Town, Shenzhen, Guangdong, China, 518000
Tel: 86-755-27374946
Bicheng Enterprise Limited is an established supplier of printed circuit boards(PCBs) in Shenzhen, China. We specialise in printed circuit board with epoxy glass material (FR-4 grade), high frequency material and metal core substrate. Our PCBs have found ready markets in more than 100 countries and regions in the world.
We have very rich circuit board products. From a simple one to a complex PCB, a rigid one to a flexible PCB, prototype to production up to 32 layers, single material to hybrid construction, phenolic paper laminate to metal core base, normal multilayer to impedance control, through hole to blind via, ball grid array (BGA) to via in pad (VIP) and so on.
Our PCB produtcs are used for a variety of purposes, including, but not limited to, computer networking, safety and surveillance, power supply, Telecommunications, Industrial Automation, RF and Microwave, Automotive Electronics, Satellite Equipment and LED Lighting etc.