eMMC test socket to SD Interface Nand flash pogo pin BGA153/169 reader Chip Size 12x16mm Pitch 0.5mm smart phone data recovery, China eMMC test socket to SD Interface Nand flash pogo pin BGA153/169 reader Chip Size 12x16mm Pitch 0.5mm smart phone data recovery Supplier

eMMC test socket to SD Interface Nand flash pogo pin BGA153/169 reader Chip Size 12x16mm Pitch 0.5mm smart phone data recovery - emmc/BGA 153/169 pogo pin test socket

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eMMC test socket to SD Interface Nand flash pogo pin BGA153/169 reader Chip Size 12x16mm Pitch 0.5mm smart phone data recovery

Model Number:eMMC153/169 pogo pin test socket
Type:eMMC153/169 pogo pin test socket
Apply to IC size:12x16mm
Apply to eMMC thickness:0.8mm to 1.5mm
Pin Pitch:0.5mm
Structure:Clamshell

BGA169/BGA153 programming adatapter is an easy use tool to connect chip and PC. Just like a U disk!
(need you to prepare SD_card_Reader in order to connect to the PC)

Includes size limiter: 12x16mm ( buy eMMC153/169 test socket , get 1 piece complimentary frame guides )

1. Apply to Samsung,Sandis k,Toshiba,Hynix,Micron,MTK,Intel, etc--eMMC
2. Apply to BGA169.
3. Accurate positioning on flat bottom pad and solder of eMMC.
4. Long operating life,up to 30,000 times.
5. Apply to eMMC thickness:0.8--1.5mm.pitch:0.5mm.
6. Could reading and writing the data of eMMC with it.
7. eMMC size : 12X16mm , we also provide other size of 11.5*13mm , 12*18mm , 14*18mm , please see more products in our store .
8. Easy to operate,insert with the SD card reader into your PC, then could read.
9. Support flat bottom and solder ball testing.

We provide one frame guide for each fixture , If you need more, please pay another $10 for per standard size plate.

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Shenzhen Hongyi Electronics Co. , Ltd

Address: No. 14th Building, Rentian Industrial South Road, Fuyong Stree, Shenzhen, Guangdong, China, 518000
Tel: 13631539217
Shenzhen Hongyi Electronics Co.,Ltd is established in 2000, which is high-tech enterprise that integrating R&D, production and sales. We focus on making kinds of test fixture, test socket, burn in socket for 16 years, which is fit for BGA, QFN, QFP, PLCC and many other packages. Now, we are the biggest semiconductor test burn-in consumptive material manufacturer in China. At the same time, We provide BGA rework and test service. In enterprise, professional technicians take up 40%,direct R&D staff take up 20%, among most of staff are high-ranking engineer with higher degree and rich experience. After years of hard work, we have had a series of national invention patent and utility model patent about test socket, adapter for integrated circuit. The company is awarded with Shenzhen hightech enterprise in 2014. Now, we are actively applying for country high-tech enterprise!

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