eMCP529 BGA529 Pogo Pin Test Socket Reader Pitch 0.5mm IC Size 15X15mm For KMR210008M-A805 SAMSUNG Note4 Flash Data Recovery - eMCP529 BGA529 Pogo Pin Test Socket
eMCP529 BGA529 Pogo Pin Test Socket Reader Pitch 0.5mm IC Size 15X15mm For KMR210008M-A805 SAMSUNG Note4 Flash Data Recovery For Sale, Most Competitive Price, Fast Delivery, Custom Service, Wholesale eMCP529 BGA529 Pogo Pin Test Socket Reader Pitch 0.5mm IC Size 15X15mm For KMR210008M-A805 SAMSUNG Note4 Flash Data Recovery, Made in China, High Quality Products!, China eMCP529 BGA529 Pogo Pin Test Socket Reader Pitch 0.5mm IC Size 15X15mm For KMR210008M-A805 SAMSUNG, eMCP529 BGA529 Pogo Pin Test Socket Reader Pitch 0.5mm IC Size 15X15mm For Note4 Flash Data Recovery Supplier, Manufacturer.eMCP529 BGA529 Pogo Pin Test Socket Reader Pitch 0.5mm IC Size 15X15mm For KMR210008M-A805 SAMSUNG Note4 Flash Data Recovery
Model Number:eMCP529 test socket
Type:eMCP529 test socket
Apply to eMCP size:15x15mm
Interface:SD interface
Structure:Pogo pin , Clamshell
Pin Pitch:0.5 mm
Package:eMCP529 , BGA529
BGA529 Pogo Pin programming adapter is an easy use tool to connect chip and PC.
(need you to prepare SD_card_Reader in order to connect to the PC)
Includes size limiter: 15x15mm
Note : Please be aware of that this type BGA529 socket can only test KMR210008M-A805 chip of SAM-SUNG Note4 , not suitable for other eMCP162/186 chips , thanks .
1. This product is eMCP529 clamshell structure test socket , improve in the base of opentop shrapnel socket , easy to insert and take out , more convenience to change frame guider .
2. Suitable for eMCP size of 15x15mm
4. Easy to operate, put the eMCP into the adapter, and then insert SD card into your PC.
5. Support flat bottom and solder ball testing.
6. Apply for eMCP529 / BGA529 data recovery and writting.
7. High quality and stable performance, eMCP data can be read easily.
Shenzhen Hongyi Electronics Co. , Ltd
Address: No. 14th Building, Rentian Industrial South Road, Fuyong Stree, Shenzhen, Guangdong, China, 518000
Tel: 13631539217
Shenzhen Hongyi Electronics Co.,Ltd is established in 2000, which is high-tech enterprise that integrating R&D, production and sales. We focus on making kinds of test fixture, test socket, burn in socket for 16 years, which is fit for BGA, QFN, QFP, PLCC and many other packages. Now, we are the biggest semiconductor test burn-in consumptive material manufacturer in China. At the same time, We provide BGA rework and test service.
In enterprise, professional technicians take up 40%,direct R&D staff take up 20%, among most of staff are high-ranking engineer with higher degree and rich experience. After years of hard work, we have had a series of national invention patent and utility model patent about test socket, adapter for integrated circuit.
The company is awarded with Shenzhen hightech enterprise in 2014. Now, we are actively applying for country high-tech enterprise!