edge grinding diamond wheel manufacturer - HMT-13
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As the manufacturer and supplier of edge grinding diamond wheel, edge grinding wheel for sapphire wafer. Homray Material Technology can provide different size edge grinding diamond wheel for chamfering machine with many brands. They are mainly used for brittle material chamfering like silicon wafer, sapphire substrate wafer etc. These products produced by in-house facility, which ensures excellent edge surface finish but with the lower cost for our customers in the world.
Get QuoteHomray Material Technology
Address: LiSheng Industrial Building,60 Suli Road, Suzhou, Jiangsu, China, 215000
Tel: 0086-67084276
Homray as the leading manufacturer and supplier of good quality diamond cutting wire, double side lapping carrier, epoxy resin working carrier, blue steel lapping carrier and ceramic block for wafer bonding, resin copper polishing plate, ductile cast iron lapping plate ,diamond edge grinding wheel, back side grinding wheel and ceramic conditioning ring etc. Our diamond cutting wire, resin lapping carrier and other consumables are widely used in various Multi Wire Saw Machine, Double Side Lapping Machine, DMP Machine (Cu Polishing Machine) for LED sapphire substrate wafer polishing, lapping process and LED EPI wafer thinning process.
