Diamond?cutting?wire?for?sapphire?substrate manufacturer - 0.35

Diamond?cutting?wire?for?sapphire?substrate manufacturer For Sale, Most Competitive Price, Fast Delivery, Custom Service, Wholesale Diamond?cutting?wire?for?sapphire?substrate manufacturer, Made in China, High Quality Products!, China diamond wire, multi wire saw diamond wire manufacturer Supplier, Manufacturer.
Diamond?cutting?wire?for?sapphire?substrate manufacturer

Diamond wires are widely applied in the fields of solar energy, LED, semiconductor, photovaltic industry. Homray Material Technology is a high-tech enterprise specializing in R&D, manufacture and service of the hard and brittle materials such as silicon and sapphire cutting tools.

Our products have complete range of articles from0.10mm to 0.44mm which are applied in silicon and sapphire cutting serving for semiconductor, PV and LED industry.

The diamond wire saw is one of the most valuable tools for cutting hard and brittle materials such as sapphire and silicon. Diamond wire is suitable to convert existing slurry saws with process support.

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Homray Material Technology

Address: LiSheng Industrial Building,60 Suli Road, Suzhou, Jiangsu, China, 215000
Tel: 0086-67084276
Homray as the leading manufacturer and supplier of good quality diamond cutting wire, double side lapping carrier, epoxy resin working carrier, blue steel lapping carrier and ceramic block for wafer bonding, resin copper polishing plate, ductile cast iron lapping plate ,diamond edge grinding wheel, back side grinding wheel and ceramic conditioning ring etc. Our diamond cutting wire, resin lapping carrier and other consumables are widely used in various Multi Wire Saw Machine, Double Side Lapping Machine, DMP Machine (Cu Polishing Machine) for LED sapphire substrate wafer polishing, lapping process and LED EPI wafer thinning process.

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