Clamshell Structure eMCP221 Reader to USB, for BGA 221 testing, size 11.5x13mm, nand flash programmer - eMCP221 BGA221 test socket
Clamshell Structure eMCP221 Reader to USB, for BGA 221 testing, size 11.5x13mm, nand flash programmer For Sale, Most Competitive Price, Fast Delivery, Custom Service, Wholesale Clamshell Structure eMCP221 Reader to USB, for BGA 221 testing, size 11.5x13mm, nand flash programmer, Made in China, High Quality Products!, China Clamshell Structure eMCP221 Reader to USB, for BGA 221 testing, size 11.5x13mm, , nand flash programmer Supplier, Manufacturer.
Clamshell Structure eMCP221 Reader to USB, for BGA 221 testing, size 11.5x13mm, nand flash programmer
Model Number:eMCP221 socket
Demo Board Type:Others
Function :eMCP221 pressure to USB test seat
Feature :bounding box of different sizes can be replac
Specification :11.5x13(mm)
Products feature:There is no ball All can be tested
Applicable :BGA221
Shippment :Free shipping
A. Apply to Samsung,Sandisk,Toshiba,Hynix,Micron,HTC,MTK,Intel, etc--eMMC
B. Apply to BGA221.
C. Accurate positioning on flat bottom pad and solder of eMCP.
D. Long operating life,up to 25,000 times. and faster reading.
E. Apply to eMCP thickness:0.8--1.5mm.
F. Could read and rewrite the data of eMMC with this.
G. eMCP size : 11.5x13mm/ 12x16mm/ 12x18mm/ 14x18mm/ 11x10mm, pitch:0.5mm.
H. Easy to operate,insert the USB into your PC, then could read.
Although whether IT1327 master control chip, IT1327 multiple partition the SD/MCP card reader USB 2.0 controller, T1327 built-in SD/MCP card power, and the integration of 5 V to 3.3 V voltage regulator, high speed USB 2.0 interface, compatible with USB 1.1. The integrated USB 2.0 transceiver macrocell interface (UTMI) and serial interface engine (you). Support bus power supply mode; The ball/no chip to test the flatness error (+ / - 0.09 mm).
Does not support hot plug, pull out the power switch, respectively support via USB or through the accessories and most of the board should be connecting pin test;
Core voltage adjustable design, with over-current protection function at the same time;
And promptly adopt import beryllium copper alloy by high precision stamping die, head shape imitate probe design, the late and hard work, gold-plated layer processing, to ensure product stability and durability.
Shenzhen Hongyi Electronics Co. , Ltd
Address: No. 14th Building, Rentian Industrial South Road, Fuyong Stree, Shenzhen, Guangdong, China, 518000
Tel: 13631539217
Shenzhen Hongyi Electronics Co.,Ltd is established in 2000, which is high-tech enterprise that integrating R&D, production and sales. We focus on making kinds of test fixture, test socket, burn in socket for 16 years, which is fit for BGA, QFN, QFP, PLCC and many other packages. Now, we are the biggest semiconductor test burn-in consumptive material manufacturer in China. At the same time, We provide BGA rework and test service.
In enterprise, professional technicians take up 40%,direct R&D staff take up 20%, among most of staff are high-ranking engineer with higher degree and rich experience. After years of hard work, we have had a series of national invention patent and utility model patent about test socket, adapter for integrated circuit.
The company is awarded with Shenzhen hightech enterprise in 2014. Now, we are actively applying for country high-tech enterprise!
Related Products
eMMC test socket to SD Interface Nand flash pogo pin BGA153/169 reader Chip Size 12x16mm Pitch 0.5mm smart phone data recovery
emmc/BGA 153/169 pogo pin test socket
eMCP529 BGA529 Pogo Pin Test Socket Reader Pitch 0.5mm IC Size 15X15mm For KMR210008M-A805 SAMSUNG Note4 Flash Data Recovery
eMCP529 BGA529 Pogo Pin Test Socket
