Automotive Battery Charger Circuit Board Assembly with Copper Clad - SYF-001
Automotive Battery Charger Circuit Board Assembly with Copper Clad For Sale, Most Competitive Price, Fast Delivery, Custom Service, Wholesale Automotive Battery Charger Circuit Board Assembly with Copper Clad, Made in China, High Quality Products!, China cheap prodocuts, china suppliers Supplier, Manufacturer.
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Automotive Battery Charger Circuit Board Assembly with Copper Clad
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Key Specifications/Special Features |
1 | We SYF have 6 PCB production lines and 4 advanced SMT lines with high speed. |
2 | All kinds of integrated circuits are accepted,such as SO, SOP, SOJ, TSOP, TSSOP, ?QFP, DIP, CSP,BGA and U-BGA , Because Our placement precision can reach chip +0.1mm on integrated circuit parts. |
3 | We SYF can provide service of 0201 chip placement, through-hole components insertion and finished products fabrication, testing and packaging. |
4 | SMT/SMD assembly and through-hole components insertion |
5 | IC preprogramming |
6 | Function verification and burn in testing |
7 | Complete unit assembly (which including plastics, metal box, coil, cable inside and more) |
8 | Environmental coating |
9 | Engineering including end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure |
10 | Packaging design and production of customized PCBA |
11 | 100% quality assurance |
12 | High mixed, low volume order is also welcomed. |
13 | Full component procurement or the substitute components sourcing |
14 | UL,ISO9001:2008, ROSH ,REACH,SGS,HALOGEN-FREE compliant |
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3.PCB?Assembly process capability
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PRODUCTION CAPABILITY OF PCB ASSEMBLY |
Stencil Size Range | ?756 mm x 756 mm |
Min. IC Pitch | ?0.30 mm |
Max. PCB Size | ?560 mm x 650 mm |
Min. PCB Thickness | ?0.30 mm |
Min. Chip Size | ?0201 (0.6 mm X 0.3 mm) |
Max. BGA Size | ?74 mm X 74 mm |
BGA Ball Pitch | ?1.00 mm (Min) / F3.00 mm (Max) |
BGA Ball Diameter | ?0.40 mm (Min) /F1.00 mm (Max) |
QFP Lead Pitch | ?0.38 mm (Min) /F2.54 mm (Max) |
Frequency of Stencil Cleaning | ?1 time / 5 ~ 10 Pieces |
Type of Assembly | ?SMT and Thru-hole |
Solder Type | ?Water Soluble Solder Paste,Leaded and Lead-free |
Type of Service | ?Turn-key,Partial Turn-key or consignment |
File Formats | ?Bill of Materials(BOM) |
?Gerber Files |
?Pick-N-Places(XYRS) |
Components | ?Passive Down to 0201 Size |
?BGA and VF BGA |
?Leadless Chip Carries/CSP |
?Double Sided SMT Assembly |
?BGA Repair and Reball |
?Part Removal and Replacement |
Component Packaging | ?Cut Tape,Tube,Reels,Loose Parts |
Testing Method | ?X-RAY Inspection and AOI Test |
Order of Quantity | ?High Mixed,Low Volume Order is also welcomed |
Remarks: In order to get accurate quote,the following information is required |
1 | Complete Data of Gerber Files for the Bare PCB Board. |
2 | Electronic Bill of Material(BOM) / Parts list detailing manufacturer& acute;s part number, quantity usage of components for reference. |
3 | Please state whether we can use alternative parts for passive components or not. |
4 | Assembly Drawings. |
5 | Functional Test Time Per Board. |
6 | Quality Standards Required |
7 | Send Us Samples (if available) |
8 | Date of the quote needs to be submitted |
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Shenzhen SYF Precision Electronics limited
Address: Room801-805,7/Floor,Dehe Building,Shajing Town, Shenzhen, Guangdong, China, 518000
Tel: 86-0755-29928869
Boya Corporation Singapore proposes an extensive range of high quality standard and special bearings,
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