-50 - 180℃ Thermal Insulation Materials , Thermal Insulation Pads for Motor controllers - AIA-1
-50 - 180℃ Thermal Insulation Materials , Thermal Insulation Pads for Motor controllers For Sale, Most Competitive Price, Fast Delivery, Custom Service, Wholesale -50 - 180℃ Thermal Insulation Materials , Thermal Insulation Pads for Motor controllers, Made in China, High Quality Products!, China cheap prodocuts, china suppliers Supplier, Manufacturer.
-50 - 180℃ Thermal Insulation Materials , Thermal Insulation Pads for Motor controllers
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The TIS?100 Series?products are the high-efficiency insulation ones with thermal conduction properties. The supplement of the insulation base film made by silica gel into the heat-conduction material creates a great effect on both the insulation and heat conduction.
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Features
> ?Highly compliant surface characteristic with high thermal conductivity?
> ?High thermal conductive and High dielectric strength?
> ?Low thermal resistance with high voltage isolation?
> ?Resistant to tears and punctures?
Applications
> ?Power conversion equipment?
> ?Power semiconductors:To packages, MOSFETs & IGBTs?
> ?Audio and Video components?
> ?Automotive control units?
> ?Motor controllers?
> ?General high pressure interface
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Typical Properties of?TIS?100 Series |
Product Name | TISTM100-01 | TISTM100-02 | TISTM100-03 | TISTM100-05 | Test Method |
Color | Grey | Pink | Yellow | Blue | Visual |
Construction &
Compostion | Ceramic filled silicone rubber | Ceramic filled silicone rubber | Ceramic filled silicone rubber | Ceramic filled silicone rubber | *** |
Composite Thickness | 9/0.23 | 12/0.3 | 18/0.45 | 9/0.23 | 12/0.3 | 18/0.45 | 9/0.23 | 12/0.3 | 18/0.45 | 9/0.23 | 12/0.3 | 18/0.45 | ASTM 2240 |
Specific Gravity | 1.75 | 1.75 | 1.75 | 1.75 | ASTM D297 |
Heat Capacity | 1.0 | 1.0 | 1.0 | 1.0 | ASTM C351 |
Hardness | 50 | 50 | 50 | 50 | ASTM D751 |
Tensile Strength | 425 | 425 | 425 | 425 | ASTM D412 |
Continuos Use Temp | (-58 to 356℉) / (-50 to 180℃) | *** |
Electrical | | |
Dielectric Breakdown Voltage | >3500 | >3500 | >3500 | >3500 | ASTM D149 |
Dielectric Constant | 5.5 | 5.5 | 5.5 | 5.5 | ASTM D150 |
Volume Resistivity | 3.5X10& quot; | 3.5X10& quot; | 3.5X10& quot; | 3.5X10& quot; | ASTM D257 |
Fire rating | 94 V0 | 94 V0 | 94 V0 | 94 V0 | Equivalent UL |
Thermal | | |
Thermal conductivity | 1.0 | 1.0 | 1.0 | 1.0 | ASTM D5470 |
Thermal Impedance @50psi | 1.52 | 2.35 | 3.45 | 1.52 | 2.35 | 3.45 | 1.52 | 2.35 | 3.45 | 1.52 | 2.35 | 3.45 | ASTM D5470 |
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Standard Thicknesses:
0.005& quot;(0.127mm)????? 0.006& quot;(0.152mm)????? 0.008& quot;(0.203mm)????? 0.009& quot;(0.228mm)
0.010& quot;(0.254mm)????? 0.012& quot;(0.304mm)????? 0.018& quot;(0.457mm)
Consult the factory alternate thickness.
Standard Sizes:???????
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16& quot; x 18& quot;(406mm x 457mm)????? 16& quot; x 200& acute;(406mm x 60.9M)
Individual die cut shapes can be supplied.
Peressure Sensitive Adhesive:?????
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Request adhesive on one side with & quot;A1& quot; suffix.
Request adhesive on doule side with & quot;A2& quot; suffix.
Reinforcement:
TIS? series sheets are fiberglass reinforced.
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Dongguan Ziitek Electronic Materials & Technology Ltd.
Address: Building B8, Industry District 鈪?City=Dongguan, , Guangdong, China, 511700
Tel: 86-769-38801208
Ziitek Thermal Conductive Materials & Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Coping with the changing need of laptop computer, high performance CPU, chip set, portable electronic equipments, alteration of power supply ,LED lighting and expansion module, base station, etc.
Thermal products electrically insulating, stable from -45鈩儈200鈩?and meets UL 94V0 rating. Our products have already passed relevant industry certification, and have been ertified as ISO9001:2000standards.Our
products also fulfill RoHS standard of EU.
Thermal products are used by many of the world's largest OEMs in various industries including automotive, computer, power supply, graphic accelerator chips, flip chips etc.
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