2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive - AIA-1

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2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive

2.5 W / mK Phase Changing Materials For IGBTs Cache Chips High Thermal Conductive

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??The TIC?800A Series?is?low melting point thermal interface material. At 50℃, The TIC?800A Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC?800A Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.?


??????The TIC?800A Series?shows no thermal performance degradation after 1,000?hours@130℃,or?after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.?

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Features:


> 0.018℃-in2 /W thermal resistance
> Naturally tacky at room temperature, no?adhesive required?????????????
> No heat sink preheating required?


Applications:


> High?Frequency Microprocessors

> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

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Typical Properties of?TIC?800A Series |
Product Name | TICTM803A | TICTM805A | TICTM808A | TICTM810A | Testing standards |
Color | Ashy | Ashy | Ashy | Ashy | Visual |
Composite Thickness | 0.003& quot;
(0.076mm) | 0.005& quot;
(0.126mm) | 0.008& quot;
(0.203mm) | 0.010& quot;
(0.254mm) |   |
Thickness Tolerance | ±0.0006& quot;
(±0.016mm) | ±0.0008& quot;
(±0.019mm) | ±0.0008& quot;
(±0.019mm) | ±0.0012& quot;
(±0.030mm) |   |
Density | 2.5g/cc | ? Helium?? Pycnometer |
Work Temperature | -25℃~125℃ |   |
phase transition? temperature | 50℃~60℃ |   |
Setting temperature | 70℃ for 5 minutes |   |
Thermal conductivity | 2.5?W/mK | ASTM D5470 (modified) |
Thermal lmpedance @ 50 psi(345 KPa)@ 50 psi(345 KPa) | 0.018℃-in2/W | 0.020℃-in2/W | 0.047℃-in2/W | 0.072℃-in2/W | ASTM D5470 (modified) |
0.11℃-cm2/W | 0.13℃-cm2/W | 0.30℃-cm2/W | 0.46℃-cm2/W |
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? Standard Thicknesses:
0.003& quot;(0.076mm)????????? 0.005& quot;(0.127mm)????????? 0.008& quot;(0.203mm)????????? 0.010& quot;(0.254mm)??????????????????
Consult the factory alternate thickness.
Standard Sizes:
9& quot; x 18& quot;(228mm x 457mm)??????9& quot; x 400& acute;(228mm x 121M)????????????
TIC?800 series are supplied with a white release paper and a bottom liner. TIC?800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:?
Peressure Sensitive Adhesive is not applicable for TIC?800 series products.
Reinforcement:?
No reinforcement is necessary. ?

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Dongguan Ziitek Electronic Materials & Technology Ltd.

Address: Building B8, Industry District 鈪?City=Dongguan, , Guangdong, China, 511700
Tel: 86-769-38801208
Ziitek Thermal Conductive Materials & Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Coping with the changing need of laptop computer, high performance CPU, chip set, portable electronic equipments, alteration of power supply ,LED lighting and expansion module, base station, etc. Thermal products electrically insulating, stable from -45鈩儈200鈩?and meets UL 94V0 rating. Our products have already passed relevant industry certification, and have been ertified as ISO9001:2000standards.Our products also fulfill RoHS standard of EU. Thermal products are used by many of the world's largest OEMs in various industries including automotive, computer, power supply, graphic accelerator chips, flip chips etc.

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